PAL16L8-10LMB
vs
TIBPAL16L8-20MFK
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCN, LCC20,.35SQ
|
QCCN,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
PAL
|
|
| Architecture |
PAL-TYPE
|
|
| JESD-30 Code |
S-CQCC-N20
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.89 mm
|
8.89 mm
|
| Number of Dedicated Inputs |
10
|
10
|
| Number of I/O Lines |
6
|
6
|
| Number of Inputs |
16
|
|
| Number of Outputs |
8
|
|
| Number of Product Terms |
64
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
10 DEDICATED INPUTS, 6 I/O
|
10 DEDICATED INPUTS, 6 I/O
|
| Output Function |
COMBINATORIAL
|
COMBINATORIAL
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
QCCN
|
| Package Equivalence Code |
LCC20,.35SQ
|
LCC20,.35SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Programmable Logic Type |
OT PLD
|
OT PLD
|
| Propagation Delay |
10 ns
|
20 ns
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
1.905 mm
|
2.03 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8.89 mm
|
8.89 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare PAL16L8-10LMB with alternatives
Compare TIBPAL16L8-20MFK with alternatives