PAL16L8DCN vs PAL16L8-10DMB feature comparison

PAL16L8DCN AMD

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PAL16L8-10DMB Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC CYPRESS SEMICONDUCTOR CORP
Package Description PLASTIC, DIP-20 DIP, DIP20,.3
Reach Compliance Code unknown not_compliant
Additional Feature PAL PAL
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-PDIP-T20 R-GDIP-T20
JESD-609 Code e0 e0
Length 26.035 mm 24.13 mm
Number of Dedicated Inputs 10 10
Number of I/O Lines 6 6
Number of Inputs 16 16
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 20
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 10 DEDICATED INPUTS, 6 I/O 10 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL BICMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Part Package Code DIP
Pin Count 20
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Screening Level 38535Q/M;38534H;883B

Compare PAL16L8DCN with alternatives

Compare PAL16L8-10DMB with alternatives