PAL16L8DCN vs PLUS16L8DN feature comparison

PAL16L8DCN AMD

Buy Now Datasheet

PLUS16L8DN YAGEO Corporation

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC PHILIPS COMPONENTS
Package Description PLASTIC, DIP-20 DIP-20
Reach Compliance Code unknown unknown
Additional Feature PAL SECURITY FUSE
Architecture PAL-TYPE
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e0
Length 26.035 mm
Number of Dedicated Inputs 10 10
Number of I/O Lines 6 6
Number of Inputs 16
Number of Outputs 8
Number of Product Terms 64
Number of Terminals 20 20
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 10 DEDICATED INPUTS, 6 I/O 10 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 1
HTS Code 8542.39.00.01

Compare PAL16L8DCN with alternatives

Compare PLUS16L8DN with alternatives