PAL16R6DVC
vs
EP610DC-15
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ALTERA CORP
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
WINDOWED, CERDIP-24
|
| Pin Count |
20
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
REGISTER PRELOAD; POWER-UP RESET
|
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
55.5 MHz
|
71.4 MHz
|
| JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.89 mm
|
|
| Number of Dedicated Inputs |
8
|
4
|
| Number of I/O Lines |
2
|
16
|
| Number of Inputs |
10
|
20
|
| Number of Outputs |
6
|
16
|
| Number of Product Terms |
64
|
160
|
| Number of Terminals |
20
|
24
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8 DEDICATED INPUTS, 2 I/O
|
4 DEDICATED INPUTS, 16 I/O
|
| Output Function |
MIXED
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
DIP24,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Programmable Logic Type |
OT PLD
|
UV PLD
|
| Propagation Delay |
10 ns
|
17 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.89 mm
|
|
| Base Number Matches |
2
|
1
|
| Peak Reflow Temperature (Cel) |
|
220
|
|
|
|
Compare PAL16R6DVC with alternatives
Compare EP610DC-15 with alternatives