PAL20L8DJC vs PAL16L8A-2DMB feature comparison

PAL20L8DJC National Semiconductor Corporation

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PAL16L8A-2DMB Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Package Description DIP, DIP24,.3 DIP, DIP20,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ACTIVE LOW OUTPUT
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-GDIP-T24 R-XDIP-T20
JESD-609 Code e0 e0
Number of Dedicated Inputs 14
Number of I/O Lines 6
Number of Inputs 20 16
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 24 20
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 14 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD EE PLD
Propagation Delay 10 ns 40 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 1
ECCN Code 3A001.A.2.C
Screening Level 38535Q/M;38534H;883B

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Compare PAL16L8A-2DMB with alternatives