PAL22VP10CF-10PC vs AMPAL16R8BPC feature comparison

PAL22VP10CF-10PC Cypress Semiconductor

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AMPAL16R8BPC AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP24,.3 DIP, DIP20,.3
Pin Count 24 20
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS POWER-UP RESET; REGISTER PRELOAD; 1 EXTERNAL CLOCK
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 90 MHz 40 MHz
JESD-30 Code R-PDIP-T24 R-PDIP-T20
JESD-609 Code e0 e0
Length 31.623 mm 26.035 mm
Number of Dedicated Inputs 11 8
Number of I/O Lines 10
Number of Inputs 22 8
Number of Outputs 10 8
Number of Product Terms 132 64
Number of Terminals 24 20
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Organization 11 DEDICATED INPUTS, 10 I/O 8 DEDICATED INPUTS, 0 I/O
Output Function MACROCELL REGISTERED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 10 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm 5.08 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BICMOS TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

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