PALC22V10-20HC vs PAL12L6-2MJ883B feature comparison

PALC22V10-20HC Cypress Semiconductor

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PAL12L6-2MJ883B Monolithic Memories (RETIRED)

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP MONOLITHIC MEMORIES
Part Package Code QLCC
Package Description WQCCJ, LDCC28,.5SQ DIP, DIP20,.3
Pin Count 28
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 41.6 MHz
JESD-30 Code S-CQCC-J28 R-XDIP-T20
JESD-609 Code e0 e0
Length 11.43 mm
Number of Dedicated Inputs 11
Number of I/O Lines 10
Number of Inputs 22 12
Number of Outputs 10 6
Number of Product Terms 132 16
Number of Terminals 28 20
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL COMBINATORIAL
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code WQCCJ DIP
Package Equivalence Code LDCC28,.5SQ DIP20,.3
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, WINDOW IN-LINE
Programmable Logic Type UV PLD OT PLD
Propagation Delay 20 ns 80 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Screening Level 38535Q/M;38534H;883B

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Compare PAL12L6-2MJ883B with alternatives