PALCE22V10-25PI vs GAL22V10C-25LD/883C feature comparison

PALCE22V10-25PI Cypress Semiconductor

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GAL22V10C-25LD/883C Teledyne e2v

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP TELEDYNE E2V (UK) LTD
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, DIP-24 CERAMIC, DIP-24
Pin Count 24
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS IT ALSO AVAILABLE IN GDIP-24 PACKAGE
Architecture PAL-TYPE
Clock Frequency-Max 30.3 MHz 26.3 MHz
JESD-30 Code R-PDIP-T24 R-CDIP-T24
JESD-609 Code e0
Length 30.099 mm
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Inputs 22
Number of Outputs 10
Number of Product Terms 132
Number of Terminals 24 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type FLASH PLD EE PLD
Propagation Delay 25 ns 25 ns
Qualification Status Not Qualified
Seated Height-Max 4.826 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Screening Level MIL-STD-883

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