PCA9500D,112
vs
935273812118
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOP
|
|
| Package Description |
SOP-16
|
HVQFN-16
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT162-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.32.00.51
|
8542.39.00.01
|
| Clock Frequency-Max |
0.4 MHz
|
0.4 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-N16
|
| JESD-609 Code |
e4
|
|
| Length |
10.3 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
|
| Number of I/O Lines |
8
|
8
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVQCCN
|
| Package Equivalence Code |
SOP16,.4
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.65 mm
|
1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.5 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
|
|
|
Compare PCA9500D,112 with alternatives
Compare 935273812118 with alternatives