PCA9554AN,112
vs
PCA9674BS
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
QFN
|
| Package Description |
DIP, DIP16,.3
|
HVQCCN, LCC16,.12SQ,20
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
0.4 MHz
|
1 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T16
|
S-PQCC-N16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
19.025 mm
|
3 mm
|
| Number of Bits |
8
|
8
|
| Number of I/O Lines |
8
|
8
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HVQCCN
|
| Package Equivalence Code |
DIP16,.3
|
LCC16,.12SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
1 mm
|
| Supply Current-Max |
100 mA
|
100 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
7.62 mm
|
3 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
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