PCD5040T
vs
KA8510Q
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
QFP,
|
QFP, QFP64(UNSPEC)
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
S-PQFP-G64
|
R-PQFP-G64
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
BURST MODE CONTROLLER
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
64
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e0
|
| Length |
|
20 mm
|
| Package Equivalence Code |
|
QFP64(UNSPEC)
|
| Seated Height-Max |
|
3 mm
|
| Supply Voltage-Nom |
|
3 V
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
1 mm
|
| Width |
|
14 mm
|
|
|
|
Compare PCD5040T with alternatives
Compare KA8510Q with alternatives