PCF5001TD
vs
SL6649-1/KG/MPES
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ZARLINK SEMICONDUCTOR INC
|
Part Package Code |
SOIC
|
|
Package Description |
SOP,
|
SOP, SOP28,.4
|
Pin Count |
28
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
Length |
17.9 mm
|
17.9 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
2.64 mm
|
Supply Current-Max |
0.1 mA
|
2 mA
|
Supply Voltage-Nom |
-2.7 V
|
1.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BIPOLAR
|
Telecom IC Type |
PAGING DECODER
|
PAGING RECEIVER
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.5 mm
|
7.5 mm
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
SOP28,.4
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare PCF5001TD with alternatives
Compare SL6649-1/KG/MPES with alternatives