PCF8574TS/3,118 vs MCP23009-E/P feature comparison

PCF8574TS/3,118 NXP Semiconductors

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MCP23009-E/P Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS MICROCHIP TECHNOLOGY INC
Part Package Code SSOP2 DIP
Package Description 4.40 MM, PLASTIC, MO-152, SOT-266-1, SSOP-20 DIP-18
Pin Count 20 18
Manufacturer Package Code SOT266-1
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 12 Weeks 10 Weeks
Samacsys Manufacturer NXP Microchip
Clock Frequency-Max 0.1 MHz 10 MHz
External Data Bus Width
JESD-30 Code R-PDSO-G20 R-PDIP-T18
JESD-609 Code e4 e3
Length 6.5 mm 22.86 mm
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of I/O Lines 8 8
Number of Ports 1 8
Number of Terminals 20 18
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LSSOP DIP
Package Equivalence Code SSOP20,.25 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 5.334 mm
Supply Voltage-Max 6 V 5.5 V
Supply Voltage-Min 2.5 V 1.8 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 7.62 mm
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 1 1
Pbfree Code Yes
Supply Current-Max 1 mA

Compare PCF8574TS/3,118 with alternatives

Compare MCP23009-E/P with alternatives