PCI2050BIZHK
vs
TSI352-66CQY
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
PQFP
|
| Package Description |
BGA-257
|
QFP-160
|
| Pin Count |
257
|
160
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A991.A.2
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Address Bus Width |
32
|
32
|
| Bus Compatibility |
PCI
|
|
| Clock Frequency-Max |
66 MHz
|
66 MHz
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PBGA-B257
|
S-PQFP-G160
|
| JESD-609 Code |
e1
|
e3
|
| Length |
16 mm
|
28 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
257
|
160
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
QFP
|
| Package Equivalence Code |
BGA257,19X19,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.4 mm
|
4.1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
16 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
EAG160
|
|
|
|
Compare PCI2050BIZHK with alternatives
Compare TSI352-66CQY with alternatives