PDTC114YMB
vs
PDTC114YM,315
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
CHIP CARRIER, R-PBCC-N3
|
1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SC-101, 3 PIN
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Date Of Intro |
2017-02-01
|
|
Additional Feature |
BUILT IN BIAS RESISTANCE RATIO IS 4.7
|
BUILT-IN BIAS RESISTOR RATIO IS 4.7
|
Case Connection |
COLLECTOR
|
COLLECTOR
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
Collector-Emitter Voltage-Max |
50 V
|
50 V
|
Configuration |
SINGLE WITH BUILT-IN RESISTOR
|
SINGLE WITH BUILT-IN RESISTOR
|
DC Current Gain-Min (hFE) |
100
|
100
|
JESD-30 Code |
R-PBCC-N3
|
R-PBCC-N3
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity/Channel Type |
NPN
|
NPN
|
Reference Standard |
AEC-Q101; IEC-60134
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Transition Frequency-Nom (fT) |
230 MHz
|
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
DFN
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
SOT883
|
Operating Temperature-Max |
|
150 °C
|
Power Dissipation-Max (Abs) |
|
0.25 W
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare PDTC114YMB with alternatives
Compare PDTC114YM,315 with alternatives