PHB21N06LT-T vs NTD18N06L-1G feature comparison

PHB21N06LT-T NXP Semiconductors

Buy Now Datasheet

NTD18N06L-1G Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Package Description SMALL OUTLINE, R-PSSO-G2 LEAD FREE, CASE 369D-01, DPAK-3
Reach Compliance Code unknown unknown
ECCN Code EAR99
Additional Feature LOGIC LEVEL COMPATIBLE LOGIC LEVEL COMPATIBLE
Avalanche Energy Rating (Eas) 34 mJ 72 mJ
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 55 V 60 V
Drain Current-Max (ID) 19 A 18 A
Drain-source On Resistance-Max 0.075 Ω 0.065 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PSSO-G2 R-PSIP-T3
Number of Elements 1 1
Number of Terminals 2 3
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Pulsed Drain Current-Max (IDM) 76 A 54 A
Qualification Status Not Qualified COMMERCIAL
Surface Mount YES NO
Terminal Form GULL WING THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Pin Count 3
Manufacturer Package Code CASE 369D-01
JESD-609 Code e3
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare PHB21N06LT-T with alternatives

Compare NTD18N06L-1G with alternatives