PHN210T
vs
BSO303SPHXUMA1
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
INFINEON TECHNOLOGIES AG
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Drain Current-Max (ID) |
3.4 A
|
7.2 A
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-609 Code |
e4
|
e3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Polarity/Channel Type |
N-CHANNEL
|
P-CHANNEL
|
Power Dissipation-Max (Abs) |
1.3 W
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin (Sn)
|
Base Number Matches |
3
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOT
|
Package Description |
|
GREEN, PLASTIC, SOP-8
|
Pin Count |
|
8
|
Factory Lead Time |
|
4 Weeks
|
Additional Feature |
|
LOGIC LEVEL COMPATIBLE
|
Avalanche Energy Rating (Eas) |
|
97 mJ
|
Configuration |
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
|
30 V
|
Drain-source On Resistance-Max |
|
0.021 Ω
|
JESD-30 Code |
|
R-PDSO-G8
|
Moisture Sensitivity Level |
|
3
|
Number of Elements |
|
1
|
Number of Terminals |
|
8
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Pulsed Drain Current-Max (IDM) |
|
36 A
|
Qualification Status |
|
Not Qualified
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Transistor Element Material |
|
SILICON
|
|
|
|
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