PI2BV3867LX
vs
PI2BV3868AE
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
PERICOM SEMICONDUCTOR CORP
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
TSSOP,
|
TSSOP,
|
| Pin Count |
24
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CB3Q/3VH/3C/2B
|
CB3Q/3VH/3C/2B
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G48
|
| JESD-609 Code |
e0
|
e3
|
| Length |
7.8 mm
|
12.5 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS EXCHANGER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
2
|
| Number of Ports |
2
|
3
|
| Number of Terminals |
24
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
1 ns
|
1 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
3.63 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.97 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
6.1 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
|
|
|
Compare PI2BV3867LX with alternatives
Compare PI2BV3868AE with alternatives