PI4ULS5V201TAEX
vs
SN74LVC1T45YZPR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DFN
|
BGA
|
| Package Description |
VSON,
|
GREEN, DSBGA-6
|
| Pin Count |
8
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
PI4
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-N8
|
R-XBGA-B6
|
| Length |
1.6 mm
|
1.4 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
8
|
6
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VSON
|
VFBGA
|
| Package Equivalence Code |
SOLCC8,.05,16
|
BGA6,2X3,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Propagation Delay (tpd) |
300 ns
|
17.7 ns
|
| Seated Height-Max |
0.55 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
1.2 mm
|
0.9 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Control Type |
|
COMMON CONTROL
|
| Count Direction |
|
BIDIRECTIONAL
|
| JESD-609 Code |
|
e1
|
| Load Capacitance (CL) |
|
15 pF
|
| Max I(ol) |
|
0.032 A
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
0.004 mA
|
| Prop. Delay@Nom-Sup |
|
17.7 ns
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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