Findchips: Compare PI74STX2GU04C6X vs 74AUP2G34GW,125

PI74STX2GU04C6X vs 74AUP2G34GW,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	PERICOM SEMICONDUCTOR CORP	NEXPERIA
Part Package Code	SOIC	TSSOP
Package Description	TSSOP,	PLASTIC, SC-88, SOT-363, SMT-6 PIN
Pin Count	6	6
Reach Compliance Code	unknown	compliant
ECCN Code	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
Family	STX	AUP/ULP/V
JESD-30 Code	R-PDSO-G6	R-PDSO-G6
JESD-609 Code	e0	e3
Length	2 mm	2 mm
Logic IC Type	INVERTER	BUFFER
Number of Functions	2	1
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	11 ns	20.8 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	3.6 V
Supply Voltage-Min (Vsup)	1.65 V	0.8 V
Supply Voltage-Nom (Vsup)	1.8 V	3.3 V
Surface Mount	YES	YES
Technology	TTL	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Finish	TIN LEAD	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	1.25 mm	1.25 mm
Base Number Matches	1	1
Rohs Code		Yes
Manufacturer Package Code		SOT363-2
Samacsys Manufacturer		Nexperia
Moisture Sensitivity Level		1
Packing Method		TR, 7 INCH
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates