PIC24F08KL302T-E/SS
vs
PIC24F08KL302T-I/ML
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Technology |
CMOS
|
CMOS
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QFN
|
Package Description |
|
6 X 6 MM, LEAD FREE, PLASTIC, QFN-28
|
Pin Count |
|
28
|
ECCN Code |
|
3A991.A.2
|
Has ADC |
|
YES
|
Additional Feature |
|
ALSO OPERATES 1.8V AT 8MHZ
|
Address Bus Width |
|
|
Bit Size |
|
16
|
CPU Family |
|
PIC24
|
Clock Frequency-Max |
|
32 MHz
|
DAC Channels |
|
NO
|
DMA Channels |
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
|
S-PQCC-N28
|
JESD-609 Code |
|
e3
|
Length |
|
6 mm
|
Moisture Sensitivity Level |
|
1
|
Number of I/O Lines |
|
24
|
Number of Terminals |
|
28
|
On Chip Program ROM Width |
|
24
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
|
YES
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HVQCCN
|
Package Equivalence Code |
|
LCC28,.24SQ,25
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
RAM (bytes) |
|
1024
|
ROM (words) |
|
2730
|
ROM Programmability |
|
FLASH
|
Seated Height-Max |
|
1 mm
|
Speed |
|
32 MHz
|
Supply Current-Max |
|
12 mA
|
Supply Voltage-Max |
|
3.6 V
|
Supply Voltage-Min |
|
3.3 V
|
Supply Voltage-Nom |
|
3.3 V
|
Surface Mount |
|
YES
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Matte Tin (Sn)
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
6 mm
|
|
|
|
Compare PIC24F08KL302T-E/SS with alternatives
Compare PIC24F08KL302T-I/ML with alternatives