PIC32MX360F512L-80I/PT vs PIC32MX360F512L-80I/BG feature comparison

PIC32MX360F512L-80I/PT Microchip Technology Inc

Buy Now Datasheet

PIC32MX360F512L-80I/BG Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code QFP BGA
Package Description 12 X 12 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-100 10 X 10 MM, 1.10 MM HEIGHT, LEAD FREE, PLASTIC, XBGA-121
Pin Count 100 121
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks 7 Weeks
Samacsys Manufacturer Microchip Microchip
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Boundary Scan YES YES
CPU Family PIC32 PIC32
Clock Frequency-Max 50 MHz 50 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PQFP-G100 S-PBGA-B121
JESD-609 Code e3 e1
Length 12 mm 10 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of DMA Channels 4 4
Number of External Interrupts 5 5
Number of I/O Lines 85 85
Number of Serial I/Os 2 2
Number of Terminals 100 121
Number of Timers 7 7
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP TFBGA
Package Equivalence Code TQFP100,.55SQ,16 BGA121,11X11,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 32768 32768
ROM (words) 524288 524288
ROM Programmability FLASH FLASH
Screening Level TS 16949 TS 16949
Seated Height-Max 1.2 mm 1.2 mm
Speed 80 MHz 80 MHz
Supply Current-Max 75 mA 75 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.4 mm 0.8 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 12 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1