PLUS16L8DN vs PLUS16L8/BRA feature comparison

PLUS16L8DN NXP Semiconductors

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PLUS16L8/BRA YAGEO Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS COMPONENTS
Package Description DIP-20 ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T20 R-CDIP-T20
Length 26.695 mm
Number of Dedicated Inputs 10 10
Number of I/O Lines 6 6
Number of Terminals 20 20
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 10 DEDICATED INPUTS, 6 I/O 10 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 10 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.06 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Additional Feature SECURITY FUSE

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