PLUS16L8DN vs PLUS16L8DN feature comparison

PLUS16L8DN NXP Semiconductors

Buy Now Datasheet

PLUS16L8DN YAGEO Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS COMPONENTS
Package Description DIP-20 DIP-20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T20 R-PDIP-T20
Length 26.695 mm
Number of Dedicated Inputs 10 10
Number of I/O Lines 6 6
Number of Terminals 20 20
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 10 DEDICATED INPUTS, 6 I/O 10 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.06 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Additional Feature SECURITY FUSE

Compare PLUS16L8DN with alternatives

Compare PLUS16L8DN with alternatives