PM308AP
vs
LM208D
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
MOTOROLA INC
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP8,.3
|
SOP, SOP8,.25
|
Pin Count |
8
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
0.01 µA
|
0.002 µA
|
Bias Current-Max (IIB) @25C |
0.007 µA
|
|
Common-mode Reject Ratio-Min |
96 dB
|
85 dB
|
Common-mode Reject Ratio-Nom |
110 dB
|
100 dB
|
Frequency Compensation |
NO
|
NO
|
Input Offset Voltage-Max |
730 µV
|
3000 µV
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
JESD-609 Code |
e0
|
e0
|
Length |
9.88 mm
|
|
Low-Bias |
NO
|
|
Low-Offset |
YES
|
NO
|
Micropower |
YES
|
YES
|
Neg Supply Voltage Limit-Max |
-18 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-20 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP8,.3
|
SOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Power |
NO
|
|
Programmable Power |
NO
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.33 mm
|
|
Supply Current-Max |
0.8 mA
|
0.4 mA
|
Supply Voltage Limit-Max |
18 V
|
|
Supply Voltage-Nom (Vsup) |
15 V
|
20 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Gain-Min |
80000
|
25000
|
Wideband |
NO
|
|
Width |
7.62 mm
|
|
Base Number Matches |
3
|
6
|
|
|
|
Compare PM308AP with alternatives