PM308AP vs M38510/10104BPA feature comparison

PM308AP Analog Devices Inc

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M38510/10104BPA Freescale Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ANALOG DEVICES INC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP8,.3 DIP, DIP8,.3
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.31.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.01 µA
Bias Current-Max (IIB) @25C 0.007 µA 0.002 µA
Common-mode Reject Ratio-Min 96 dB
Common-mode Reject Ratio-Nom 110 dB
Frequency Compensation NO NO
Input Offset Voltage-Max 730 µV 1000 µV
JESD-30 Code R-PDIP-T8 R-XDIP-T8
JESD-609 Code e0 e0
Length 9.88 mm
Low-Bias NO
Low-Offset YES NO
Micropower YES
Neg Supply Voltage Limit-Max -18 V
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power NO
Programmable Power NO
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm
Supply Current-Max 0.8 mA
Supply Voltage Limit-Max 18 V 22 V
Supply Voltage-Nom (Vsup) 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Voltage Gain-Min 80000 20000
Wideband NO
Width 7.62 mm
Base Number Matches 3 11
Power Supplies +-5/+-20 V
Screening Level 38535Q/M;38534H;883B
Slew Rate-Min 0.05 V/us

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