PSMN002-25P
vs
PSMN025-100D/T3
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
PLASTIC, DPAK-3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
| Drain Current-Max (ID) |
75 A
|
47 A
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-609 Code |
e3
|
e3
|
| Number of Elements |
1
|
1
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
230 W
|
150 W
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN
|
| Base Number Matches |
2
|
2
|
| Pin Count |
|
3
|
| Avalanche Energy Rating (Eas) |
|
260 mJ
|
| Case Connection |
|
DRAIN
|
| DS Breakdown Voltage-Min |
|
100 V
|
| Drain-source On Resistance-Max |
|
0.025 Ω
|
| JESD-30 Code |
|
R-PSSO-G2
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
2
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Pulsed Drain Current-Max (IDM) |
|
188 A
|
| Qualification Status |
|
Not Qualified
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
SINGLE
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
|
|
|
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