PUMH1,115 NXP SemiconductorsBuy Now Datasheet |
PUMH11 NXP SemiconductorsBuy Now Datasheet |
Rohs Code | Yes | Yes |
---|---|---|
Part Life Cycle Code | Transferred | Transferred |
Ihs Manufacturer | NXP SEMICONDUCTORS | NXP SEMICONDUCTORS |
Part Package Code | TSSOP | SC-88 |
Package Description | PLASTIC, SC-88, 6 PIN | PLASTIC, SC-88, 6 PIN |
Pin Count | 6 | 6 |
Manufacturer Package Code | SOT363 | |
Reach Compliance Code | compliant | compliant |
ECCN Code | EAR99 | EAR99 |
HTS Code | 8541.21.00.95 | |
Additional Feature | BUILT-IN BIAS RESISTOR RATIO IS 1 | BUILT IN BIAS RESISTOR RATIO IS 1 |
Collector Current-Max (IC) | 0.1 A | 0.1 A |
Collector-Base Capacitance-Max | 3.5 pF | |
Collector-Emitter Voltage-Max | 50 V | 50 V |
Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
DC Current Gain-Min (hFE) | 60 | 30 |
JESD-30 Code | R-PDSO-G6 | R-PDSO-G6 |
JESD-609 Code | e3 | e3 |
Moisture Sensitivity Level | 1 | 1 |
Number of Elements | 2 | 2 |
Number of Terminals | 6 | 6 |
Operating Temperature-Max | 150 °C | 150 °C |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Shape | RECTANGULAR | RECTANGULAR |
Package Style | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Cel) | 260 | 260 |
Polarity/Channel Type | NPN | NPN |
Power Dissipation Ambient-Max | 0.4 W | |
Power Dissipation-Max (Abs) | 0.2 W | 0.2 W |
Qualification Status | Not Qualified | Not Qualified |
Surface Mount | YES | YES |
Terminal Finish | TIN | Tin (Sn) |
Terminal Form | GULL WING | GULL WING |
Terminal Position | DUAL | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | 30 |
Transistor Application | SWITCHING | SWITCHING |
Transistor Element Material | SILICON | SILICON |
VCEsat-Max | 0.3 V | |
Base Number Matches | 1 | 10 |
Pbfree Code | Yes | |
Samacsys Manufacturer | NXP | |
Reference Standard | AEC-Q101 | |
Transition Frequency-Nom (fT) | 230 MHz | |