PUMH1,115 vs PUMH18,115 feature comparison

PUMH1,115 NXP Semiconductors

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PUMH18,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description PLASTIC, SC-88, 6 PIN PLASTIC, SMD, SC-88, 6 PIN
Pin Count 6 6
Manufacturer Package Code SOT363 SOT363
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.95
Additional Feature BUILT-IN BIAS RESISTOR RATIO IS 1 BUILT IN BIAS RESISTOR RATIO 2.1
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Base Capacitance-Max 3.5 pF
Collector-Emitter Voltage-Max 50 V 50 V
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE) 60 50
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 2 2
Number of Terminals 6 6
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 0.4 W
Power Dissipation-Max (Abs) 0.2 W 0.3 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
VCEsat-Max 0.3 V
Base Number Matches 1 1

Compare PUMH1,115 with alternatives

Compare PUMH18,115 with alternatives