QS316212PV vs CBT16212DL,512 feature comparison

QS316212PV Integrated Device Technology Inc

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CBT16212DL,512 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Package Description SSOP, SSOP56,.4 PLASTIC, SSOP-56
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 316212 CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e0 e4
Length 18.415 mm 18.425 mm
Logic IC Type BUS EXCHANGER BUS EXCHANGER
Moisture Sensitivity Level 1 2
Number of Bits 12 12
Number of Functions 2 1
Number of Ports 4 4
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP56,.4 SSOP56,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 225 260
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.794 mm 2.8 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 30
Width 7.493 mm 7.5 mm
Base Number Matches 2 2
Part Package Code SSOP
Pin Count 56
Manufacturer Package Code SOT371-1

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