R5F100LEAFB
vs
R5F100LEAFB#30
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Package Description |
LFQFP, QFP64,.47SQ,20
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| Has ADC |
YES
|
|
| Additional Feature |
OPERATES AT 1.6V MIN SUPPLY AT 4 MHZ
|
|
| Address Bus Width |
|
|
| Bit Size |
16
|
|
| CPU Family |
RL78
|
|
| Clock Frequency-Max |
20 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G64
|
|
| Length |
10 mm
|
|
| Number of DMA Channels |
2
|
|
| Number of I/O Lines |
58
|
|
| Number of Terminals |
64
|
|
| Number of Timers |
9
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFQFP
|
|
| Package Equivalence Code |
QFP64,.47SQ,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
4096
|
|
| ROM (words) |
65536
|
|
| ROM Programmability |
FLASH
|
|
| Speed |
32 MHz
|
|
| Supply Current-Max |
7 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
2.7 V
|
|
| Supply Voltage-Nom |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
10 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER, CISC
|
| Base Number Matches |
6
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
LFQFP
|
| Pin Count |
|
64
|
| Manufacturer Package Code |
|
PLQP0064KB
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare R5F100LEAFB with alternatives
Compare R5F100LEAFB#30 with alternatives