RFP8P10
vs
MTP8P10
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
GENERAL ELECTRIC SOLID STATE
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
Base Number Matches |
5
|
3
|
Rohs Code |
|
No
|
Package Description |
|
FLANGE MOUNT, R-PSFM-T3
|
Additional Feature |
|
LEADFORM OPTIONS ARE AVAILABLE
|
Case Connection |
|
DRAIN
|
Configuration |
|
Single
|
DS Breakdown Voltage-Min |
|
100 V
|
Drain Current-Max (Abs) (ID) |
|
8 A
|
Drain Current-Max (ID) |
|
8 A
|
Drain-source On Resistance-Max |
|
0.4 Ω
|
FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
Feedback Cap-Max (Crss) |
|
180 pF
|
JEDEC-95 Code |
|
TO-220AB
|
JESD-30 Code |
|
R-PSFM-T3
|
JESD-609 Code |
|
e0
|
Number of Elements |
|
1
|
Number of Terminals |
|
3
|
Operating Mode |
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
|
150 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Polarity/Channel Type |
|
P-CHANNEL
|
Power Dissipation Ambient-Max |
|
75 W
|
Power Dissipation-Max (Abs) |
|
75 W
|
Pulsed Drain Current-Max (IDM) |
|
25 A
|
Qualification Status |
|
Not Qualified
|
Surface Mount |
|
NO
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Position |
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
Turn-off Time-Max (toff) |
|
350 ns
|
Turn-on Time-Max (ton) |
|
230 ns
|
|
|
|