RP73F1E16R9BTDG vs AR02BPC3Y16R9 feature comparison

RP73F1E16R9BTDG TE Connectivity

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AR02BPC3Y16R9 Token Electronics Industry Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer TE CONNECTIVITY LTD TOKEN ELECTRONICS INDUSTRY CO LTD
Package Description CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Additional Feature HIGH PRECISION
Construction Chip Chip
Manufacturer Series RP73
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method TR, PAPER, 7 INCH Bulk
Rated Power Dissipation (P) 0.063 W 0.0625 W
Rated Temperature 70 °C
Reference Standard MIL-STD-202
Resistance 16.9 Ω 16.9 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Series RP73 AR
Size Code 0402 0402
Surface Mount YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 25 V 25 V
Base Number Matches 1 1
JESD-609 Code e3
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier

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