S2004TB
vs
RTL8201FN-VB-CG
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
REALTEK SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
|
Package Description |
LBGA, BGA208,17X17,50
|
HVQCCN,
|
Pin Count |
208
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B208
|
S-XQCC-N48
|
Length |
23 mm
|
6 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
208
|
48
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
LBGA
|
HVQCCN
|
Package Equivalence Code |
BGA208,17X17,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.65 mm
|
1 mm
|
Supply Current-Max |
980 mA
|
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
CMOS
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
23 mm
|
6 mm
|
Base Number Matches |
3
|
1
|
|
|
|
Compare S2004TB with alternatives
Compare RTL8201FN-VB-CG with alternatives