S2004TB
vs
TJA1100HNZ
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
QFN
|
| Package Description |
LBGA, BGA208,17X17,50
|
HVQFN-36
|
| Pin Count |
208
|
36
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B208
|
S-PQCC-N36
|
| Length |
23 mm
|
6 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
208
|
36
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA208,17X17,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.65 mm
|
1 mm
|
| Supply Current-Max |
980 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
23 mm
|
6 mm
|
| Base Number Matches |
3
|
1
|
| Manufacturer Package Code |
|
SOT1092-2
|
| ECCN Code |
|
5A991
|
| Factory Lead Time |
|
15 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
|
|
Compare S2004TB with alternatives
Compare TJA1100HNZ with alternatives