S2009TB
vs
TJA1100HNZ
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
QFN
|
Package Description |
LBGA,
|
HVQFN-36
|
Pin Count |
208
|
36
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B208
|
S-PQCC-N36
|
Length |
23 mm
|
6 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
208
|
36
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.65 mm
|
1 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
23 mm
|
6 mm
|
Base Number Matches |
1
|
1
|
Manufacturer Package Code |
|
SOT1092-2
|
ECCN Code |
|
5A991
|
Factory Lead Time |
|
15 Weeks
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
1
|
Screening Level |
|
AEC-Q100
|
Terminal Finish |
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
|
|
Compare S2009TB with alternatives
Compare TJA1100HNZ with alternatives