S2009TB
vs
TLE6250GV33XUMA1
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
End Of Life
|
| Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
INFINEON TECHNOLOGIES AG
|
| Part Package Code |
BGA
|
SOIC
|
| Package Description |
LBGA,
|
SOP,
|
| Pin Count |
208
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B208
|
R-PDSO-G8
|
| Length |
23 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
208
|
8
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.65 mm
|
1.75 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
CAN TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
23 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Samacsys Manufacturer |
|
Infineon
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Terminal Finish |
|
Tin (Sn)
|
|
|
|
Compare S2009TB with alternatives
Compare TLE6250GV33XUMA1 with alternatives