S2301
vs
CMF20120D
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROHM CO LTD
|
WOLFSPEED INC
|
| Package Description |
UNCASED CHIP, X-XXUC-N
|
HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
1200 V
|
1200 V
|
| Drain Current-Max (ID) |
40 A
|
33 A
|
| Drain-source On Resistance-Max |
0.111 Ω
|
0.11 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
X-XXUC-N
|
R-PSFM-T3
|
| Number of Elements |
1
|
1
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Pulsed Drain Current-Max (IDM) |
80 A
|
78 A
|
| Surface Mount |
YES
|
NO
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UNSPECIFIED
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON CARBIDE
|
SILICON CARBIDE
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Samacsys Manufacturer |
|
Wolfspeed
|
| Avalanche Energy Rating (Eas) |
|
2200 mJ
|
| JEDEC-95 Code |
|
TO-247
|
| JESD-609 Code |
|
e3
|
| Number of Terminals |
|
3
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare S2301 with alternatives