S29GL512S11DHI020
vs
S29GL512S11DHIV23
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SPANSION INC
|
Package Description |
9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64
|
LEAD FREE, PACKAGE
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.1.A
|
3A991.B.1.A
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
110 ns
|
110 ns
|
Boot Block |
BOTTOM/TOP
|
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
YES
|
YES
|
Data Polling |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B64
|
S-PBGA-B64
|
JESD-609 Code |
e1
|
|
Length |
9 mm
|
9 mm
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
512
|
512
|
Number of Terminals |
64
|
64
|
Number of Words |
67108864 words
|
67108864 words
|
Number of Words Code |
64000000
|
64000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
64MX8
|
64MX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA64,8X8,40
|
BGA64,8X8,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Page Size |
16 words
|
16 words
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
2.7 V
|
2.7 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Sector Size |
64K
|
64K
|
Standby Current-Max |
0.0001 A
|
0.0001 A
|
Supply Current-Max |
0.08 mA
|
0.08 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Toggle Bit |
YES
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
9 mm
|
9 mm
|
Base Number Matches |
3
|
3
|
Part Package Code |
|
BGA
|
Pin Count |
|
64
|
|
|
|
Compare S29GL512S11DHI020 with alternatives
Compare S29GL512S11DHIV23 with alternatives