S29PL127J60BFI003 vs S29PL127J60BFI001 feature comparison

S29PL127J60BFI003 AMD

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S29PL127J60BFI001 Spansion

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Package Description , 11 X 8 MM, LEAD FREE, FBGA-80
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Base Number Matches 3 3
Pbfree Code Yes
Rohs Code Yes
Part Package Code BGA
Pin Count 80
Access Time-Max 60 ns
Boot Block BOTTOM/TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B80
JESD-609 Code e1
Length 11 mm
Memory Density 134217728 bit
Memory IC Type FLASH
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 16,254
Number of Terminals 80
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA80,8X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size 8 words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1 mm
Sector Size 4K,32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES
Type NOR TYPE
Width 8 mm

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