S34ML01G200BHA000
vs
S34ML01G200BHI000
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Transferred
|
| Ihs Manufacturer |
|
SPANSION INC
|
| Package Description |
|
BGA-63
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
3A991.B.1.A
|
| HTS Code |
|
8542.32.00.51
|
| Samacsys Manufacturer |
|
Spansion
|
| Access Time-Max |
|
25 ns
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
NO
|
| Data Polling |
|
NO
|
| Data Retention Time-Min |
|
10
|
| JESD-30 Code |
|
R-PBGA-B63
|
| Length |
|
11 mm
|
| Memory Density |
|
1073741824 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Sectors/Size |
|
1K
|
| Number of Terminals |
|
63
|
| Number of Words |
|
134217728 words
|
| Number of Words Code |
|
128000000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
128MX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
VFBGA
|
| Package Equivalence Code |
|
BGA63,10X12,32
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Page Size |
|
2K words
|
| Parallel/Serial |
|
PARALLEL
|
| Programming Voltage |
|
3.3 V
|
| Qualification Status |
|
Not Qualified
|
| Ready/Busy |
|
YES
|
| Seated Height-Max |
|
1 mm
|
| Sector Size |
|
128K
|
| Standby Current-Max |
|
0.00005 A
|
| Supply Current-Max |
|
0.03 mA
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Toggle Bit |
|
NO
|
| Type |
|
SLC NAND TYPE
|
| Width |
|
9 mm
|
| Write Cycle Time-Max (tWC) |
|
0.000025 ms
|
| Base Number Matches |
|
1
|
|
|
|