S34ML01G200BHB003 vs S34ML01G200TFI003 feature comparison

S34ML01G200BHB003 Cypress Semiconductor

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S34ML01G200TFI003 Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description VFBGA, TSOP1-48
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A991.B.1.A
HTS Code 8542.32.00.51 8542.32.00.51
Command User Interface YES YES
Common Flash Interface NO NO
Data Polling NO NO
Data Retention Time-Min 10 10
JESD-30 Code R-PBGA-B63 R-PDSO-G48
Length 11 mm 18.4 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 63 48
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Equivalence Code BGA64,10X12,32 TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3.3 V 3.3 V
Screening Level AEC-Q100
Seated Height-Max 1 mm 1.2 mm
Standby Current-Max 0.00001 A 0.00005 A
Supply Current-Max 0.035 mA 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Type SLC NAND TYPE SLC NAND TYPE
Width 9 mm 12 mm
Base Number Matches 2 3
Access Time-Max 25 ns
Number of Sectors/Size 1K
Page Size 2K words
Qualification Status Not Qualified
Ready/Busy YES
Sector Size 128K
Toggle Bit NO
Write Cycle Time-Max (tWC) 0.000025 ms