S34ML01G200BHI000 vs S34ML01G200BHI003 feature comparison

S34ML01G200BHI000 Cypress Semiconductor

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S34ML01G200BHI003 Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description VFBGA, BGA63,10X12,32 BGA-63
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A991.B.1.A
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 25 ns 25 ns
Command User Interface YES YES
Data Polling NO NO
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 11 mm 11 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Sectors/Size 1K 1K
Number of Terminals 63 63
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA63,10X12,32 BGA63,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size 2K words 2K words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Power Supplies 3/3.3 V 3/3.3 V
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1 mm 1 mm
Sector Size 128K 128K
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.03 mA 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit NO NO
Type SLC NAND TYPE SLC NAND TYPE
Width 9 mm 9 mm
Base Number Matches 1 1

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