S34ML01G200TFI000 vs NAND01GW3B2BZA6 feature comparison

S34ML01G200TFI000 Cypress Semiconductor

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NAND01GW3B2BZA6 Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Package Description TSOP1-48 TFBGA,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 25 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48 R-PBGA-B63
JESD-609 Code e3
Length 18.4 mm 12 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Sectors/Size 1K
Number of Terminals 48 63
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TFBGA
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Page Size 2K words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Power Supplies 3/3.3 V
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1.05 mm
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position DUAL BOTTOM
Toggle Bit NO
Type SLC NAND TYPE
Width 12 mm 9.5 mm
Base Number Matches 1 4
Part Package Code BGA
Pin Count 63

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