S5T8554B01-S0B0
vs
TP3054BDW
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Companding Law |
MU-LAW
|
MU-LAW
|
| Filter |
YES
|
YES
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
10.3 mm
|
10.3 mm
|
| Neg Supply Voltage-Nom |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS/ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Additional Feature |
|
FULL DUPLEX
|
| Gain Tolerance-Max |
|
0.15 dB
|
| JESD-609 Code |
|
e4
|
| Linear Coding |
|
NOT AVAILABLE
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SOP16,.4
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max |
|
9 mA
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare S5T8554B01-S0B0 with alternatives
Compare TP3054BDW with alternatives