SA5532AN
vs
TLE2024QDWREP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
SOIC-16
|
| Pin Count |
8
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
1 µA
|
0.09 µA
|
| Common-mode Reject Ratio-Nom |
100 dB
|
90 dB
|
| Input Offset Voltage-Max |
5000 µV
|
1100 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G16
|
| Length |
9.5 mm
|
10.3 mm
|
| Neg Supply Voltage Limit-Max |
-22 V
|
-20 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
2
|
4
|
| Number of Terminals |
8
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
2.65 mm
|
| Slew Rate-Nom |
9 V/us
|
0.5 V/us
|
| Supply Voltage Limit-Max |
22 V
|
20 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
10000
|
1700
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.07 µA
|
| Common-mode Reject Ratio-Min |
|
80 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Current-Max (IIO) |
|
0.1 µA
|
| JESD-609 Code |
|
e4
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SOP16,.4
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Slew Rate-Min |
|
0.4 V/us
|
| Supply Current-Max |
|
1.2 mA
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Voltage Gain-Min |
|
100000
|
| Wideband |
|
NO
|
|
|
|
Compare SA5532AN with alternatives
Compare TLE2024QDWREP with alternatives