SA555N
vs
555/BPA
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS COMPONENTS
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP8,.3
|
,
|
Pin Count |
8
|
|
Reach Compliance Code |
unknown
|
unknown
|
Analog IC - Other Type |
SQUARE
|
PULSE; RECTANGULAR
|
JESD-30 Code |
R-PDIP-T8
|
R-CDIP-T8
|
Length |
9.5 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP8,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.2 mm
|
|
Supply Voltage-Max (Vsup) |
16 V
|
18 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
|
Base Number Matches |
4
|
3
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Additional Feature |
|
IT CAN ALSO OPERATE AT 15V NOM
|
|
|
|
Compare 555/BPA with alternatives