SA555N
vs
ICM7555IN,602
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP8,.3
|
DIP, DIP8,.3
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
SQUARE
|
PULSE
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| Length |
9.5 mm
|
9.5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
4.2 mm
|
| Supply Voltage-Max (Vsup) |
16 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
4
|
1
|
| Manufacturer Package Code |
|
SOT97-1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Output Frequency-Max |
|
0.5 MHz
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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