SAA3010PN
vs
933880690118
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP, DIP28,.6
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
REMOTE CONTROL TRANSMITTER IC
|
REMOTE CONTROL TRANSMITTER IC
|
| JESD-30 Code |
R-PDIP-T28
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
MOS
|
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
28
|
| Length |
|
17.9 mm
|
| Number of Functions |
|
1
|
| Seated Height-Max |
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
|
7 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Transmission Media |
|
INFRARED
|
| Width |
|
7.5 mm
|
|
|
|
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