SAA3010PN
vs
TC9259N
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
TOSHIBA CORP
|
| Package Description |
DIP, DIP28,.6
|
0.400 INCH, 1.78 MM PITCH, PLASTIC, SDIP-28
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Consumer IC Type |
REMOTE CONTROL TRANSMITTER IC
|
RECEIVER IC
|
| JESD-30 Code |
R-PDIP-T28
|
R-PDIP-T28
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SDIP
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
MOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
1.778 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
28
|
| Length |
|
25.6 mm
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
4.1 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
10.16 mm
|
|
|
|
Compare TC9259N with alternatives